Freescale Semiconductor Tape & Reel

Freescale, with its origin as Motorola Semiconductor and now part of NXP has long been a semiconductor packaging leader. With its historic dominance in automotive IC's, microcontrollers and CPU's for Apple products, NXP Freescale was an early adopter of BGA technology and high reliability packaging.

Staying current

with this packaging leader today is a different challenge. NXP's roadmap is consistent with the general industry / JEDEC BGA, QFP roadmaps so NPI Materials easily supports NXP Freescale entire portfolio of analog, microcontrollers and PowerPC/ASP components.

NXP Freescale's RF and Sensor product lines

presents a more difficult challenge because each component is essentially a low volume, odd shaped custom package. NPI has tooled various versions of the SOP-8 ported SMT pressure sensor products in response to customer programs. NPI also applies pick-up points for top-ported sensors prior to taping. NPI will quote unsupported components on a case-by-case basis in order to cover as much of NXP Freescale's portfolio as practical.

NXP Package	NXP P/N | Case	Image	Notes
1317A-04	NXP MPXA6115A Case 98ARH99089A		Exclusive T&R service
SOP-8 Horizontal Port	NXP MPXA6115A Case 98ASA99303D		Exclusive T&R service
SOP-8 Ported	NXP MPC6115A Case 98ASB17757C		Exclusive T&R service

But the new frontier

is the RF package. RF packages by deign are mostly non-JEDEC, irregular shaped and therefore difficult to match up to a standard open tool carrier. As an Authorized Distributor of 3M carrier tape, and with access to the world's top suppliers like CPAK and Advantek, NPI Materials will deliver the solution when called upon. Go Back