On Semiconductor, with its origin as Motorola Semiconductor has long been a semiconductor packaging leader. With true industry leadership in discrete and power semiconductors, On's package portfolio covers practically every JEDEC standard package for low pin-count devices. One of the biggest challenge over the past two decades is finding a carrier tape for the Microsemi/Diodes/On Semi Powermite or DO-216AA. NPI now offers tape and servicess for that package as well as the balance of On's packaging portfolio.
Staying current
with this packaging leader is in NPI's wheelhouse. To minimize cost and footprint, ON is active in the development of leadless QFN and flip-chip WLCSP packages. NPI Materials works to align our tape & reel service offering with each package. Support of ON's 485AA aka CSP-2.5X4.5mm and 499BF aka YZP-8 are just two examples of NPI Materials' leadership tape & reel capability in North America.
ON Semi pushes Tape and Reel differentiation to the extreme
by offering two or four different pin one orientations on its standard factory reels. This presents a challenge for most T & R shops but NPI's component expertise allows us to decode the part number and orient the component exactly the way the factory would, saving our customers possible rework situations.
But the new frontier
is the WLCSP package. As many ways as a designer can lay-out a chip, is the number of dimensions that will drive WLCSP packaging and the carrier tapes required to hold them. As an Authorized Distributor of 3M carrier tape, and with access to the world's top suppliers like CPAK and Advantek, NPI Materials will deliver the solution when called upon.
